Determination of Additives and Byproducts in an Acid Copper Plating Bath by Liquid Chromatography

Application Note 145 Determination of the Suppressor Additive in Acid Copper Plating Bath INTRODUCTION EQUIPMENT Copper electroplating systems are used for the deposition of copper on semiconductor wafers.1,2 The primary components of an acid copper plating bath are copper sulfate,…

Wh ite Pa p er 7 12 11 Measurement and Control of Copper Additives in Electroplating Baths by High-Performance Liquid Chromatography Marc A. Plante1, Stewart Fairlie2, Bruce Bailey1, Ian N. Acworth1 1 Thermo Fisher Scientific, Chelmsford, MA 2 Seagate Technology,…

Application Update 143 Determination of Chloride in Acid Copper Plating Bath INTRODUCTION Columns: Ion chromatography (IC) provides a convenient method for the determination of chloride in acid copper plating baths. These baths are used for deposition of copper on semiconductor…

Quantitation and Characterization of Copper Plating Bath Additives by Liquid Chromatography with Charged Aerosol Detection Marc Plante, Bruce Bailey, Ian N. Acworth Thermo Fisher Scientific, Chelmsford, MA, USA Overview Purpose: Analytical methods to determine quantities of copper plating bath additives…