Quantitation and Characterization of Copper Plating Bath Additives by Liquid Chromatography with Charged Aerosol Detection

Wh ite Pa p er 7 12 11 Measurement and Control of Copper Additives in Electroplating Baths by High-Performance Liquid Chromatography Marc A. Plante1, Stewart Fairlie2, Bruce Bailey1, Ian N. Acworth1 1 Thermo Fisher Scientific, Chelmsford, MA 2 Seagate Technology,…

Application Note 145 Determination of the Suppressor Additive in Acid Copper Plating Bath INTRODUCTION EQUIPMENT Copper electroplating systems are used for the deposition of copper on semiconductor wafers.1,2 The primary components of an acid copper plating bath are copper sulfate,…

Metrohm White Paper Automated CVS Method Development and Optimization of Multicomponent Plating Baths Michael Kubicsko, Ritesh Vyas Over the past three decades, the Cyclic Voltammetric Stripping (CVS) based analysis of organic additives in electroplating copper baths has been the standard…

Application Note 139 Determination of Additives and Byproducts in an Acid Copper Plating Bath by Liquid Chromatography INTRODUCTION Copper electroplating systems are used for the deposition of copper on semiconductor wafers.1,2 The primary components of an acid copper plating bath…