Application News No. AD-0196 DSC-60 Plus/Epoxy/Curing Epoxy Curing Studies with Isothermal Differential Scanning Calorimetry Method Ai Ming Chua, Joyce Lim, Zhen Hao Lee Application Development & Support Centre, Shimadzu (Asia Pacific) Pte Ltd, Singapore Introduction Epoxy resins are used…
Key words
curing, dsc, tgm, epoxy, rht, isothermal, temp, enthalpy, cycle, heating, curingb, min, exotherm, mechanical, resin